Test & Inspection
In a world where array packages are increasingly contributing to the higher density requirements of today's circuit boards, Ensil International Corp. has the necessary knowledge, experience, and equipment to check the integrity of terminations hidden beneath area array component packages, such as ball grid arrays (BGAs) and chip scale packages (CSPs), as well as those beneath flip-chip bare dice.
Ensil International Corp. can offer a full range of testing services covering in-circuit test (ATE), functional and full system testing.
Developing a test strategy with client is part of our service and as part of contractual obligation the project inspection records and test results can be provided on request.
This level of flexibility and precision gives us the capability to handle most inspection requests encompassing through-hole, SMT and BGA technologies. For more information regarding Ensil’s test and inspection capabilities, contact us at info@ensilinternational.com